Contact Finish - Mating | Gold |
---|---|
Operating Temperature | - |
Contact Material - Post | Phosphor Bronze |
Housing Material | Liquid Crystal Polymer (LCP) |
Contact Finish Thickness - Mating | 1.00µin (0.025µm) |
Termination | Solder |
Mounting Type | Surface Mount |
Product Status | Active |
Number of Positions or Pins (Grid) | 8 (2 x 4) |
Pitch - Post | 0.050" (1.27mm) |
Contact Finish Thickness - Post | 1.00µin (0.025µm) |
Series | - |
Type | SOIC |
Contact Finish - Post | Gold |
Pitch - Mating | 0.050" (1.27mm) |
Contact Material - Mating | Phosphor Bronze |
Features | Board Guide, Closed Frame |
Package | Tape & Reel (TR) |