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| Mount | Surface Mount |
|---|---|
| Max Supply Voltage | 3.6V |
| Memory Type | OTP |
| Radiation Hardening | No |
| Package / Case | 208-FBGA, CSPBGA |
| Technology | CMOS |
| Lifecycle Status | PRODUCTION (Last Updated: 1 month ago) |
| Core Architecture | Blackfin |
| Terminal Form | BALL |
| Number of Pins | 208 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Operating Temperature | 0°C~70°C TA |
| Bit Size | 32 |
| Mounting Type | Surface Mount |
| Pin Count | 208 |
| Number of UART Channels | 2 |
| Memory Size | 132kB |
| Packaging | Tray |
| Terminal Pitch | 0.8mm |
| Non-Volatile Memory | ROM (32kB) |
| Min Supply Voltage | 1.7V |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Position | BOTTOM |
| Number of Terminations | 208 |
| Supply Voltage | 1.8V |
| Height | 1.36mm |
| Width | 17.1mm |
| Lead Free | Contains Lead |
| Pbfree Code | no |
| RoHS Status | ROHS3 Compliant |
| Data Bus Width | 16b |
| RAM Size | 32kB |
| Low Power Mode | YES |
| Boundary Scan | YES |
| Number of I/O | 48 |
| Barrel Shifter | YES |
| JESD-609 Code | e1 |
| Factory Lead Time | 12 Weeks |
| Number of Timers/Counters | 9 |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Peak Reflow Temperature (Cel) | 260 |
| Series | Blackfin® |
| Internal Bus Architecture | MULTIPLE |
| Type | Fixed Point |
| Length | 17.1mm |
| Subcategory | Microprocessors |
| Operating Supply Voltage | 3.3V |
| Part Status | Active |
| Voltage - Core | 1.10V |
| Frequency | 600MHz |
| Voltage - I/O | 1.8V 2.5V 3.3V |
| Interface | DMA, Ethernet, I2C, PPI, SPI, SPORT, UART, USB |
| Number of Ethernet Channels | 1 |
| Base Part Number | ADSP-BF527 |
